Based on the processing requirements of wafer materials, choose the appropriate centerless grinding or cylindrical grinding method to achieve the demand dimensions and surface finish.

JHC centerless grinding T series is suitable for workpieces with an outer diameter range of Ø6 to 230 mm. The machine is equipped with a 610mm grinding wheel allowing for substantial material removal and providing high precision and a consistent surface finish. The JHU cylindrical grinding machine can grind workpieces with a maximum diameter of 250 mm and a maximum length of 600 mm, with a load of 70 kg between two centers, offering excellent suitability for various types of wafer shapes.

Both centerless and cylindrical grinding machines can be equipped with automation, designed based on the characteristics of the workpiece. This will effectively enhance processing yield and production efficiency.