JOEN LIH MACHINERY CO., LTD.
JOEN LIH MACHINERY
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JOEN LIH / 06. 02. 2023
JOEN LIH / 06. 02. 2023
JOEN LIH / 06. 02. 2023
Machine Specifications: Diameter of lapping plate 1127 mm Diameter of carrier(planetary carrier) Ø370mm,DP12, Z200 Quantity of carrier(planetary carrier) 5 SETS Total processed quantity: 6”Wafer: 15 pcs 8” Wafer: 5 pcs 12” Wafer: 5 pcs Max. lapping thickness 40 mm Min. lapping thickness 0.4 mm
JOEN LIH / 06. 02. 2023
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