JoenLih's Linear Guide Grinding Machine constructed with two vertical spindles and one horizontal spindle; this design enables three-surface grinding on a linear guide way at one time.

Machine Specifications: Diameter of lapping plate 1127 mm Diameter of carrier(planetary carrier) Ø370mm,DP12, Z200 Quantity of carrier(planetary carrier) 5 SETS Total processed quantity: 6”Wafer: 15 pcs 8” Wafer: 5 pcs 12” Wafer: 5 pcs Max. lapping thickness 40 mm Min. lapping thickness 0.4 mm