Machine Specifications:
Diameter of lapping plate 1127 mm
Diameter of carrier(planetary carrier) Ø370mm,DP12, Z200
Quantity of carrier(planetary carrier) 5 SETS
Total processed quantity:
6”Wafer: 15 pcs
8” Wafer: 5 pcs
12” Wafer: 5 pcs
Max. lapping thickness 40 mm
Min. lapping thickness 0.4 mm