TMTS Virtual Application
Double-sided Lapping/Polishing Machine
Product Description:
Diameter of lapping plate: 1127 mm
Diameter of carrier(planetary carrier): Ø370mm, DP12, Z200
Quantity of carrier(planetary carrier): 5 SETS
Total processed quantity:
6” Wafer: 15 pcs
8” Wafer: 5 pcs
12” Wafer: 5 pcs
Max. lapping thickness: 40 mm
Min. lapping thickness: 0.4 mm
Diameter of carrier(planetary carrier): Ø370mm, DP12, Z200
Quantity of carrier(planetary carrier): 5 SETS
Total processed quantity:
6” Wafer: 15 pcs
8” Wafer: 5 pcs
12” Wafer: 5 pcs
Max. lapping thickness: 40 mm
Min. lapping thickness: 0.4 mm
