【COMING SOON】Ultrasonic Grinding Wheel Toolholder Series

Product Description:
BT-30 / BT-40 Grinding Wheel Toolholder Series
♦ Applied in CNC grinding process, especially for the making of ring-shaped components (i.e. quartz/focus ring, SiC wafer carrier/susceptor) used in semiconductor manufacturing equipment
♦ Higher Machining Efficiency and Material Removal Rate (MRR)
♦ Balance Quality Grade G2.5
♦ High Precision Runout <5 μm
♦ Double-sided Restraint Taper
♦ Thread Locking Tool Interface
♦ Applied in CNC grinding process, especially for the making of ring-shaped components (i.e. quartz/focus ring, SiC wafer carrier/susceptor) used in semiconductor manufacturing equipment
♦ Higher Machining Efficiency and Material Removal Rate (MRR)
♦ Balance Quality Grade G2.5
♦ High Precision Runout <5 μm
♦ Double-sided Restraint Taper
♦ Thread Locking Tool Interface