♦ Specifications available: HBT-40-W01 / HSK-A63-W01
♦ Suitable for CNC grinding processes, specifically for machining ring-shaped components in semiconductor manufacturing equipment (such as quartz rings, SiC wafer susceptors, etc.)
♦ Increase Machining Efficiency by 2–3 times
♦ Increase Material Removal Rate by 3 times
♦ Thread-locking grinding wheel