SEMICON TAIWAN 2026

Sep. 2-4, 2026
TaiNEX 1&2, Taipei
TMBA SMART TEAM @ SEMICON TAIWAN 2026

晶片背後,精密製造相挺

Behind Every Advanced Chip Stands Precision Manufacturing

📍 Booth #Q5352|南港2館1樓
📅 2026/09/02–09/04
⏱️ 展商亮點發表 每日兩場
從精密加工、定位控制、精準溫控,到關鍵零組件與半導體設備應用── TMBA 攜手 9 家台灣精銳廠商,組成 「Manufacturing Solutions Collective 解決方案團區」
Promo Code:TMBA
TMBA SMART TEAM Booth
 

展商亮點 Exhibitor Highlights 晶片背後,精密製造相挺 Behind Every Advanced Chip Stands Precision Manufacturing

結構抗震與熱穩定 Structural & Thermal Stability

大詠城 WINSON

解決微震動干擾與熱變形痛點,提供極致平穩的機台基座。
Resolves "Micro-vibration" and "Thermal Drift", providing an extremely stable machine base.

威士頓 WEXTEN

降低製程腔體與發熱模組的溫度漂移,提升 Etch / CVD 製程穩定性。
Minimizes Temperature Drift in Process Chambers and Heating Modules, Enhancing Etch/CVD Process Stability.

核心動力與無塵運轉 Core Drive & Clean Operation

普森 POSA

杜絕軸承潤滑油氣造成的微污染,100%滿足無塵室標準。
Eradicates "Particle" contamination from bearing oil mist, 100% meeting strict Cleanroom standards.

心得科技 USYNC

透過減少研磨主軸不平衡,實現卓越的晶圓面型控制與邊緣防護。
Delivers Superior Wafer Profile Control and Edge Protection by Mitigates Grinding Spindle Imbalance.

硬脆異材與載盤加工 Advanced Material Machining

協鴻 HARTFORD

攻克 SiC 等硬脆異材加工時的高刀耗與表面微裂紋 (SSD) 痛點。
Overcomes high tool wear and "Sub-surface Damage (SSD)" when machining hard & brittle materials like SiC.

鍵和 JAINNHER

突破高精密晶棒外徑研磨的產能瓶頸,適用晶圓尺寸最大可達 12 吋。
Breaks through production bottlenecks in high-precision ingot OD grinding, accommodating wafer sizes up to 12 inches.

表面精度與微觀處理 Surface Precision & Micro-Finishing

普發 PERFECT MACHINE

廣泛用於半導體矽晶之研磨製程、LED藍寶石晶圓研磨製程及LED晶減薄製程。
For R600, it’s widely used in semiconductor silicon crystal grinding process, LED sapphire wafer grinding process and LED wafer grinding process.

元駿 LV INTERNATIONAL

去除管路交叉孔與 O-ring 槽的微毛邊,減少 Particle 藏匿與殘留死角。
Deburr internal cross-holes and O-ring grooves to eliminate particle-trapping sites and dead space.

設備安全與國際驗證 Equipment Safety & International Certification

精機中心 PMC

提供完整的設備安全設計輔導與國際驗證服務 (SEMI S2/CE),結合碳足跡盤查,協助設備商快速接軌全球半導體供應鏈標準,實踐綠色製造。
Provides complete equipment safety design consulting and international certification services (SEMI S2/CE), alongside carbon footprint verification, helping manufacturers quickly meet global semiconductor supply chain standards and achieve green manufacturing.
Suppliers & Products
Booth no.I2010
High-precision Internal, External & Radius grinding machine (Danobat, ES & Danobat-Overbeck, DE), Gap control system (Elaso , CH), Precision grinding tools (Meister, DIAMETAL, CH), Magnetic filtration (Eclipse Magnetics, UK), Transfer Line Machine (PRECI
Booth no.I3205
CNC Wire Cut EDM, CNC EDM, ZNC EDM, Drilling EDM, CNC Drilling EDM, Polishing machines
Booth no.J2946
Cylinders, Gripper, Values, Vacuum Ejectors, Fittings, Airline Service Unit, Electro-Pneumatic Regulator, Pressure Flow Sensor, Electric Gripper Electric Actuator, Chemical Valve
Booth no.J3038
CNC Control Cabinet, CNC Operation Panel, PCB Relay Module, PCB I/O Module, PCB Interface Module, PCB I/F Module, LED Luminaries for Machines Tools, Automatic Loading and Unloading Systems, Material Handing Systems and related equipment, CIM, Robots for M
Booth no.L0326
Ball Bearing Linear Guide, Ironless Linear Motor, CLMS - Compact Linear Motor Stage, DD Motor, 6 Axis Robot
Booth no.N0270
Measuring Instruments
Booth no.P6206
2D laser/Bending, Punching machine
Booth no.Q5143
Booth no.Q5246
Pneumatic Components which are including Solenoid Valves, Air Units, Air Cylinders, Gripper, Stopper Cylinders, Guide Cylinders, Electric Actuators, Fittings and Tubing
Booth no.R8112
Machine calibration systems, Machine tool probing systems, Position and motion control systems, 5-axis CMM system, shopfloor flexible gauging system
Booth no.R8205
Ultrasonic Cleaning Machine
Booth no.S7006
Hinges, Door Latches, Draw Latches, Leveling Feet, Handles, Lid Stay Holders, Casters, Digital Torque Wrenches
Booth no.S7841
Laboratory Instruments Equipment Design and Manufacturing
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