👍🏻 2x Higher Machining Efficiency
👍🏻 3x Better Workpiece Quality
👍🏻 Great Reduction in Tool Wear

HIT utilized the ultrasonic machining module for profile grinding of aluminum oxide (Al2O3) ceramic. Along with HIT's new product - Ultrasonic Electroplated Diamond Grinding Tool, the high frequency micro-vibration of ultrasonic brought easier removal of ceramic particles. The reduction in grinding force and tool wear not only contributed to great workpiece quality but also allowed for an increase in feed rate, which enhanced 2x of the overall machining efficiency.
💡Learn more about the case study【HIT Ultrasonic-assisted Profile Grinding of Aluminum Oxide Ceramic】at https://www.hit-tw.com/advantagedetails.aspx?id=292

Aluminum Oxide (Al2O3) ceramic is widely applied in the semiconductor industry, especially being made into key components for semiconductor manufacturing equipment, such as Ceramic Electrostatic Chuck (ESC, E-chuck). It uses electrostatic force to chuck/hold down wafer to ensure stability during wafer dicing process.

The high frequency micro-vibration of HIT ultrasonic-assisted machining technology offers better mechanism in flushing ceramic particles from the grinding tool. With HIT's new product - Ultrasonic Electroplated Diamond Grinding Tool, it helps bring great reduction in grinding force and tool wear. HIT aims to provide customers upgraded machining process with lower costs and high productivity!

💥NEW Product Launch!! HIT Ultrasonic Electroplated Diamond Grinding Tool💥
🔹 HIT customized ultrasonic electroplated grinding tool with exclusive formulation.
🔹 Work perfectly with HIT Ultrasonic Machining Module.
🔹 Maximize the benefits of CNC grinding process with HIT ultrasonic.

👉🏻Want to know more about the new product? Feel free to CONTACT US at https://www.hit-tw.com/contact.aspx 👈🏻