TMTS Virtual Application
Ultrasonic Micro-drilling SiC
Ultrasonic Machining of SiC (Silicon Carbide) : Micro-Drilling｜Hantop Intelligence Tech.
HIT utilized the ultrasonic machining module for the micro-drilling on SiC (Silicon Carbide). HIT's ultrasonic-assisted machining technology greatly enhanced the hole quality. The size of edge-cracks is reduced by 53%, compared to that without ultrasonic. The ultrasonic machining module offers the highest amount of precision and flexibility when it comes to fabricating components that require high quality, high precisional repeatability, and high yield rate.
💡Learn more about HIT Ultrasonic-assisted Machining at https://www.hit-tw.com/
Silicon carbide has a Mohs hardness rating of 9, making it an excellent material choice for high-precision mechanical components. The material also bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as substrates and showerheads. Showerheads are used for even distribution in the semiconductor industry. The hole quality and configuration of the concentrated holes on the product are important to maintain high yield rate of wafer foundry.
However, due to the high hardness of silicon carbide, the risk of machining SiC resides in poor hole quality with massive size of edge-cracks. If the thrust force and torque are not well-controlled during the drilling process, both the quality and positional precision of the holes will be severely impacted. HIT ultrasonic-assisted machining technology can help reduce cutting force/heat and allows for an easier chip removal process, resulting in great improvement in workpiece quality.
💡Read more about Ultrasonic Machining on SiC deep hole drilling case at https://www.hit-tw.com/advantagedetails.aspx?id=122
HIT utilized the ultrasonic machining module for the micro-drilling on SiC (Silicon Carbide). HIT's ultrasonic-assisted machining technology greatly enhanced the hole quality. The size of edge-cracks is reduced by 53%, compared to that without ultrasonic. The ultrasonic machining module offers the highest amount of precision and flexibility when it comes to fabricating components that require high quality, high precisional repeatability, and high yield rate.
💡Learn more about HIT Ultrasonic-assisted Machining at https://www.hit-tw.com/
Silicon carbide has a Mohs hardness rating of 9, making it an excellent material choice for high-precision mechanical components. The material also bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as substrates and showerheads. Showerheads are used for even distribution in the semiconductor industry. The hole quality and configuration of the concentrated holes on the product are important to maintain high yield rate of wafer foundry.
However, due to the high hardness of silicon carbide, the risk of machining SiC resides in poor hole quality with massive size of edge-cracks. If the thrust force and torque are not well-controlled during the drilling process, both the quality and positional precision of the holes will be severely impacted. HIT ultrasonic-assisted machining technology can help reduce cutting force/heat and allows for an easier chip removal process, resulting in great improvement in workpiece quality.
💡Read more about Ultrasonic Machining on SiC deep hole drilling case at https://www.hit-tw.com/advantagedetails.aspx?id=122
