👍🏻 Machining Efficiency: 1.5x Higher
👍🏻 Surface Quality: 1.6x Better
👍🏻 Tool Life: 2x Longer

【hit Ultrasonic Process Solution】AlSiC (Aluminum Silicon Carbide): Heat Dissipating Plate in Semiconductor Packaging

Although the use of AlSiC in advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) is still emerging, its role as a high-efficiency thermal material is expected to become a future industry trend due to increasing package density and power consumption.

The material combines the excellent thermal conductivity of aluminum with the high rigidity, high heat resistance, and low thermal expansion coefficient of silicon carbide. It can reduce packaging stress and failure risk caused by thermal cycling, while offering better mechanical rigidity and stability, and supporting lightweight packaging module designs.

🔹High frequency micro-vibration of ultrasonic helps reduce grinding force and improves chip evacuation.
✨ More space of enhancement for cutting parameters can reduce process time.
✨ Better chip evacuation brings lower surface roughness and longer tool life.

🔹Ultrasonic Process Solution Package including:
✨ Cutting Parameters
✨ Tool Selection
✨ Process Configuration

Offering customers a comprehensive process development solution!