TMTS Virtual Application
Ultrasonic Machining of Wafer Manufactu
Balancing surface flatness and consumable costs in SiC wafer grinding is a key industry challenge.
Powered by Hansvent’s patented Ultrasonic grinding spindle, our ultrasonic-assisted technology effectively reduces grinding resistance and boosts wheel life:
🔹 6-inch Wafer (#2000): Grinding Ratio (GR) surges 70% from 2.4 to 4.1.
🔹8-inch Wafer (#8000): Grinding Ratio (GR) increases 55% from 0.9 to 1.4.
Lower your production costs and minimize downtime. Discover the future of wafer processing with Hansvent.
👉🏻 Learn more about our ultrasonic module products? Feel free to contact us: https://www.hit-tw.com/tw/contact.aspx 👈🏻
💡 Learn more about ultrasonic-assisted [Semiconductor Component Machining] application cases: https://www.hit-tw.com/tw/advantage.a...
Hantop Intelligence Tech. (HIT)
✨ Ultrasonic Advanced Material Machining Solutions ✨
☎️ 04-2285-0838
📧 sales@hit-tw.com
Powered by Hansvent’s patented Ultrasonic grinding spindle, our ultrasonic-assisted technology effectively reduces grinding resistance and boosts wheel life:
🔹 6-inch Wafer (#2000): Grinding Ratio (GR) surges 70% from 2.4 to 4.1.
🔹8-inch Wafer (#8000): Grinding Ratio (GR) increases 55% from 0.9 to 1.4.
Lower your production costs and minimize downtime. Discover the future of wafer processing with Hansvent.
👉🏻 Learn more about our ultrasonic module products? Feel free to contact us: https://www.hit-tw.com/tw/contact.aspx 👈🏻
💡 Learn more about ultrasonic-assisted [Semiconductor Component Machining] application cases: https://www.hit-tw.com/tw/advantage.a...
Hantop Intelligence Tech. (HIT)
✨ Ultrasonic Advanced Material Machining Solutions ✨
☎️ 04-2285-0838
📧 sales@hit-tw.com
